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Thermal Management of Vehicle Cabins, External Surfaces, and Onboard Electronics: An Overview Review

Garrett J. Marshall, Colin P. Mahony, Matthew J. Rhodes, Steve R. Daniewicz, Nicholas Tsolas, Scott M. Thompson

Engineering 2019, Volume 5, Issue 5,   Pages 954-969 doi: 10.1016/j.eng.2019.02.009

Abstract: in vehicle thermal management technology and modeling, with a focus on three key areas: the cabin, electronicsFor the thermal management of electronics, including batteries and insulated-gate bipolar transistors

Keywords： Vehicle design     Automotive engineering     Electronics packaging     Heat pipes     Climate control     Heating ventilation    

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Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 6,   Pages 704-715 doi: 10.1007/s11705-022-2270-z

Abstract: from dark green to brown, indicating the potential for applications in active and intelligent food packaging

Keywords： bio-based     multifunction     colorimetric indicator     active and intelligent packaging    

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ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 1,   Pages 95-108 doi: 10.15302/J-FASE-2022478

Abstract:

● Consumer preference for environmentally-friendly beverage packaging

Keywords： China     consumer preference     food and beverage packaging     green identity label     information treatment    

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Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact

Qin ZHANG, Yi ZHENG, Jing LIU

Frontiers in Energy 2012, Volume 6, Issue 4,   Pages 311-340 doi: 10.1007/s11708-012-0214-x

Abstract: Electronics, such as printed circuit board (PCB), transistor, radio frequency identification (RFID),As an alternative, the newly emerging ink-jet printing electronics are gradually shaping modern electronicThe method has been named as direct writing of electronics based on alloy and metal (DREAM) ink.discoveries being kept made along this category, it was found that a new area enabled by the DREAM ink electronicsThe merits and demerits between conventional printed electronics and the new direct writing methods were

Keywords： direct writing of electronics based on alloy and metal (DREAM) ink     direct writing of electronics     printedelectronics     liquid metal ink     integrated circuit     consumer electronics     nano liquid metal    

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Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue

Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti

Frontiers of Chemical Science and Engineering 2020, Volume 14, Issue 2,   Pages 288-303 doi: 10.1007/s11705-019-1875-3

Abstract: A synthetic mixture of real waste packaging plastics representative of the residue from a material recovery

Keywords： packaging plastics waste     plasmix     pyrolysis     zeolite catalyst     degradation temperature    

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Tailoring electrical conductivity of two dimensional nanomaterials using plasma for edge electronics:

Aswathy Vasudevan, Vasyl Shvalya, Aleksander Zidanšek, Uroš Cvelbar

Frontiers of Chemical Science and Engineering 2019, Volume 13, Issue 3,   Pages 427-443 doi: 10.1007/s11705-019-1805-4

Abstract: review deals with recent advances in the modification of 2D carbon nanostructures for novel ‘edge’ electronics

Keywords： graphene     edge electronics     2D nanomaterials     plasma     electrical conductivity    

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Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths

Juan Carlos HERNANDEZ-CASTANEDA, Boon Keng LOK, Hongyu ZHENG

Frontiers of Mechanical Engineering 2020, Volume 15, Issue 2,   Pages 303-318 doi: 10.1007/s11465-019-0562-x

Abstract: These materials are commonly used in manufacturing functional printed electronics for large-area applications

Keywords： laser sintering     copper nanoparticles     printed electronics    

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Multi-time scale dynamics in power electronics-dominated power systems

Xiaoming YUAN, Jiabing HU, Shijie CHENG

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 3,   Pages 303-311 doi: 10.1007/s11465-017-0428-z

Abstract:

Electric power infrastructure has recently undergone a comprehensive transformation from electromagnetics to semiconductors. Such a development is attributed to the rapid growth of power electronic converter applications in the load side to realize energy conservation and on the supply side for renewable generations and power transmissions using high voltage direct current transmission. This transformation has altered the fundamental mechanism of power system dynamics, which demands the establishment of a new theory for power system control and protection. This paper presents thoughts on a theoretical framework for the coming semiconducting power systems.

Keywords： power electronics     power systems     multi-time scale dynamics     mass-spring-damping model     self-stabilizing    

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Back-End Electronics Manufacturing Equipment in China and Their Key Components

Chen Xin , Chen Yun , Chen Xun , Wu Xiaojie

Strategic Study of CAE 2022, Volume 24, Issue 4,   Pages 74-84 doi: 10.15302/J-SSCAE-2022.04.008

Abstract: production, and high-precision lithography, occurs primarily in the front-end industry, whereas chip packagingsemiconductors; packaging chips; producing electric vacuum devices and flat-panel displays, electronic, the United States has established the National Semiconductor Technology Center and an advanced packagingetching, polishing and thinning, wafer dicing and batch transfer, interconnect bonding, integrated packaging, photovoltaic solar energy equipment, and semiconductor packaging equipment.

Keywords： back-end electronics manufacturing     supply chain reshaping     electronics manufacturing equipment     multi-chip    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract:

The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging andThe very high importance not to forget packaging at the beginning of a project, when hoping to industrialize

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Take back and treatment of discarded electronics: a scientific update

Ab STEVELS, Jaco HUISMAN, Feng WANG, Jinhui LI, Boyang LI, Huabo DUAN

Frontiers of Environmental Science & Engineering 2013, Volume 7, Issue 4,   Pages 475-482 doi: 10.1007/s11783-013-0538-8

Abstract: This paper indicates that the performance of tack-back and treatment of electronic waste (e-waste) system can be improved substantially. This can be reached by better taking into account in a better way the big variety in material composition and potential toxicity of electrical and electronic products – from a technical, organizational and regulatory perspective. Realizing that there is no ‘one size fit for all’ and combining smart tailor made solutions with economic of sale will result in the best environmental gain/cost ratio. Several examples show how science and engineering have supported or will support this approach.

Keywords： e-waste     take back     treatment     substantially    

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Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs) Research Article

Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn

Frontiers of Information Technology & Electronic Engineering 2023, Volume 24, Issue 6,   Pages 916-926 doi: 10.1631/FITEE.2200573

Abstract: design of Ka-band (33 GHz) that features broadband and great filtering response, and is based on glass packagingCompared to traditional packaging materials (printed circuit board, low temperature co-fired ceramic,Si, etc.), TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging

Keywords： Filtering packaging antenna (FPA)     Through-glass vias (TGVs)     3D packaging devices     Laser bonding    

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The road to sustainable use and waste management of plastics in Portugal

Frontiers of Environmental Science & Engineering 2022, Volume 16, Issue 1,   Pages 5-5 doi: 10.1007/s11783-021-1439-x

Abstract:

• Portugal recycles 34% of the 40 kg/hab year of plastic packaging waste

Keywords： Single-use plastics     Plastic packaging     Plastic waste     Waste management     Waste shipment     Lightweight    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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A Personal Desktop Liquid-Metal Printer as a Pervasive Electronics Manufacturing Tool for Society in Artical

Jun Yang,Yang Yang,Zhizhu He,Bowei Chen,Jing Liu

Engineering 2015, Volume 1, Issue 4,   Pages 506-512 doi: 10.15302/J-ENG-2015042

Abstract:

It has long been a dream in the electronics industry to be able to write out electronics directly,This liquid-metal printer is an automatic, easy-to-use, and low-cost personal electronics manufacturingThis desktop liquid-metal printer is expected to become a basic electronics manufacturing tool for a

Keywords： liquid-metal printer     printed electronics     additive manufacturing     maker     do-it-yourself (DIY) electronics    

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Title Author Date Type Operation

Thermal Management of Vehicle Cabins, External Surfaces, and Onboard Electronics: An Overview

Garrett J. Marshall, Colin P. Mahony, Matthew J. Rhodes, Steve R. Daniewicz, Nicholas Tsolas, Scott M. Thompson

Journal Article

Anthocyanins/chitosan films doped by nano zinc oxide for active and intelligent packaging: comparison

Journal Article

ENVIRONMENTAL ATTITUDES AND CONSUMER PREFERENCE FOR ENVIRONMENTALLY-FRIENDLY BEVERAGE PACKAGING: THE

Journal Article

Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact

Qin ZHANG, Yi ZHENG, Jing LIU

Journal Article

Thermal and catalytic pyrolysis of a synthetic mixture representative of packaging plastics residue

Simona Colantonio, Lorenzo Cafiero, Doina De Angelis, Nicolò M. Ippolito, Riccardo Tuffi, Stefano Vecchio Ciprioti

Journal Article

Tailoring electrical conductivity of two dimensional nanomaterials using plasma for edge electronics:

Aswathy Vasudevan, Vasyl Shvalya, Aleksander Zidanšek, Uroš Cvelbar

Journal Article

Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths

Juan Carlos HERNANDEZ-CASTANEDA, Boon Keng LOK, Hongyu ZHENG

Journal Article

Multi-time scale dynamics in power electronics-dominated power systems

Xiaoming YUAN, Jiabing HU, Shijie CHENG

Journal Article

Back-End Electronics Manufacturing Equipment in China and Their Key Components

Chen Xin , Chen Yun , Chen Xun , Wu Xiaojie

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Take back and treatment of discarded electronics: a scientific update

Ab STEVELS, Jaco HUISMAN, Feng WANG, Jinhui LI, Boyang LI, Huabo DUAN

Journal Article

Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)

Zhen FANG, Jihua ZHANG, Libin GAO, Hongwei CHEN, Wenlei LI, Tianpeng LIANG, Xudong CAI, Xingzhou CAI, Weicong JIA, Huan GUO, Yong LI,zhenfang@std.uestc.edu.cn,jhzhang@uestc.edu.cn

Journal Article

The road to sustainable use and waste management of plastics in Portugal

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

A Personal Desktop Liquid-Metal Printer as a Pervasive Electronics Manufacturing Tool for Society in

Jun Yang,Yang Yang,Zhizhu He,Bowei Chen,Jing Liu

Journal Article